The Lurie Nanofabrication Facility (LNF) ordered a Heidelberg Instruments DWL 66+ Maskless Laser Lithography System with CHIPS Act funding through the Silicon Crossroads Microelectronics Hub, led by ARI (Applied Research Institute).
The LNF is open 24/7 to both University of Michigan users and to external researchers including Microelectronic Commons participants, companies, and national labs. The LNF technical staff have extensive experience supporting users in state-of-the-art nanofabrication research and development, and provide dedicated training to onboard new users and get projects started.
(Courtesy of the University of Michigan)
(Courtesy of the University of Michigan)
(Courtesy of the University of Michigan)
(Courtesy of the University of Michigan)
Users can look forward to write speeds up to 2,000 mm2/min in the high-throughput mode and a resolution down to 300 nm in the high-resolution mode. This will enable not only faster turnaround times for prototype devices (no dedicated photomask required) but also volume production of nanoscale devices. In addition, advanced greyscale exposure mode will facilitate fabrication of micro-optical elements and backside alignment will enable device integration and packaging.
The DWL 66+ will be a key advantage as partners work together to cross the lab-to-fab gap across microelectronics, including wide and ultrawide bandgap devices for high-frequency and high-power applications, quantum technology, integrated photonics, and devices and heterogeneous system integration for advanced memory, AI, and edge computing.
The Heidelberg Instruments systems and technology pool comprises high-precision Maskless Aligner (MLA) and Laser Lithography systems for Direct Writing of 2D, 2.5D and 3D microstructures to mask-making, and systems based on Thermal Scanning Probe Lithography (t-SPL) for the advanced nanopatterning. 3D laser lithography systems based on Two-Photon Polymerization (TPP) technology close the gap between conventional laser lithography – the basis of Heidelberg Instruments’ strong core business – and the Thermal Scanning Probe Lithography (t-SPL) for nanopatterning.
Advancements in microelectronics continuously rely on shrinking electronic devices and incorporating novel materials in active regions to achieve ever-higher speeds and new functionalities in device structures.
Maskless lithography tools like the MLA, DWL and VPG+ series of Heidelberg Instruments, have emerged as a transformative technology in microelectronics lithography, offering numerous advantages compared to traditional photolithography.
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