Dates & Events

SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products and brings in the most up-to-date market and technology trends.

Heidelberg Instruments will be represented by Regional Business Network (RBN) Singapore.

Visit RBN at Booth #B1820!

2025 IEEE 75th Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Visit us at booth 206!

The International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN), affectionately known as “3-Beams,” is the premier gathering of scientists and engineers. This is the 68^th meeting of the EIPBN, where top researchers from academia, government laboratories, and industry from around the world meet to present and discuss recent trends and future directions in these technologies.

Visit us at booth 26!

The Total Solution Exhibition for Electronic Equipment 2025.

The Swiss NanoConvention brings together Swiss and international leaders from science and industry in the field of «nano», key figures in innovation and technology, entrepreneurs, investors, administrators and politicians. It’s a platform for connecting people, networking, debating and exchanging ideas – or even generating new ones.

Visit us at booth 12!

Leti Innovation Days 2025 will offer insights in most recent advances. Global semiconductor industry leaders will meet at LID World Summit 2025 filled with inspiring keynotes, insight-filled conferences, and exciting demos of what’s next in CEA-Leti’s lab-to-fab pipeline.

Heidelberg Instruments will be represented by Innodys S.A.R.L.

Visit Innodys at Booth #9!

27. Weltleitmesse und Kongress für Komponenten, Systeme und Anwendungen der Photonik.

Visit Heidelberg Instruments at booth B3.319!

Welcome to your Transducers 2025, your biennial international conference. The mission of our international conference is to enhance the collective knowledge of the global transducers technical community and to stimulate its growth by providing an inclusive forum for communication, education, and collaboration.

Following successful 2D TMDs conferences in Cambridge and Hong Kong, the 2D TMDs 2025 conference in Cambridge will be held again. The conference will again gather leading researchers from academia and industry to present and discuss cutting-edge research in the field of atomically thin TMDs and related materials. The conference will cover latest developments in synthesis of 2D TMDs and their implementation in electronics, photonics, catalysis, as well as energy conversion and storage.

IMID 2025 will feature keynote addresses, invited talks, oral and poster presentations, tutorials, workshops, and a young leaders conference (YLC). Attendees will also have the opportunity to explore the latest display technologies and products showcased by leading global companies.

The Advanced Semiconductor Packaging & Chiplet Show is a B2B event to showcase the latest semiconductor packaging and processing technologies to global IDM, OSAT, AI&ICT, computing, automotive, and electronics manufacturers.

It is once again the largest-ever SEMICON Taiwan in its own history, with over 1,100 exhibitors from 25 countries using more than 3,700 booths, and attracting 85,000 visitors.

Heidelberg Instruments will be represented by Stella International Corporation Limited.

Visit us at Booth #Q5242

The CIOE 2025 will be held from September 10 to 12, 2025, at the Shenzhen World Exhibition and Convention Center. As a comprehensive exhibition covering the entire optoelectronics industry chain, CIOE brings together over 3,700 high-quality exhibitors from more than 30 countries and regions worldwide.

Heidelberg Instruments will be represented by Stella International Corporation Limited.

The upcoming conference will feature comprehensive tracks covering a wide spectrum of Micro/Nano Engineering domains, ensuring a holistic exploration of the field’s advancements. After Rhodes (2019), Turin (2021), Leuven (2022), Berlin (2023), and Montpellier (2024), the International Conference on Micro – and Nano Engineering (MNE) series will take place in the National Oceanography Center, Southampton in September 2025.

Heidelberg Instruments is Platinum Sponsor of MNE 2025

Visit Heidelberg Instruments at Booth No. 6-5!