Optimized for industrial manufacturing, ensuring high throughput and seamless production line integration
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Product Description
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The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.
Key Features
- High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
- Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
- Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
- Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.
Applications
- Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
- Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
- MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
- Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
- Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
- Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
- OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.
Workflow and Cost Efficiency
- Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
- By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
- The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
- A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
- Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
- Modularity allows for quick maintenance, keeping downtime to a minimum.
Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.
The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.
Key Features
- High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
- Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
- Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
- Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.
Applications
- Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
- Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
- MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
- Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
- Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
- Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
- OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.
Workflow and Cost Efficiency
- Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
- By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
- The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
- A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
- Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
- Modularity allows for quick maintenance, keeping downtime to a minimum.
Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.
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Product Highlights
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Direct-write Lithography
No mask-related costs, effort, or security risksFlexibility
Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serializationTime-saving
Shorter time from prototyping to production. Digital design management replaces conventional mask libraryExposure Quality
Optical compensation of scaling, rotation; patented substrate tracking technologyDynamic Autofocus
Superior critical dimensions (CD) uniformity on warped or corrugated substratesExposure Speed
300 x 300 mm2 in 5 minutes (write mode 3, two exposure modules)Full Facility Integration
Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)User-friendly
SEMI-compliant user interface; customized workflow “wizards” for system operators -
Available Modules
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Automated Loading Module
SEMI-standard BOLTS plane can be configured for open cassettes or Load Ports for FOUP. The number and configuration of ports can be selected and customized for round or rectangular substratesManufacturing Execution System (MES)
Integration Customizable workflow “wizards” to start exposure jobs, and integration to a central MES via SECS/GEM or OPC-UA protocolsBackside Alignment
Visual or through-wafer IR backside alignment available with 1 µm positioning accuracyExposure Wavelengths
High-power diode lasers with 7 W at 375 nm or 20 W at 405 nm with long lifetime are availableMultipurpose Vacuum Chuck
Customized vacuum chucks are available for applications with special substrates (e.g. warped panels)Service Contracts
Service contract grades for faster on-site support and participation in the spare parts pool
The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.
Key Features
- High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
- Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
- Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
- Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.
Applications
- Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
- Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
- MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
- Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
- Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
- Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
- OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.
Workflow and Cost Efficiency
- Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
- By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
- The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
- A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
- Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
- Modularity allows for quick maintenance, keeping downtime to a minimum.
Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.
The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.
Key Features
- High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
- Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
- Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
- Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.
Applications
- Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
- Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
- MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
- Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
- Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
- Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
- OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.
Workflow and Cost Efficiency
- Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
- By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
- The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
- A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
- Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
- Modularity allows for quick maintenance, keeping downtime to a minimum.
Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.
Direct-write Lithography
Flexibility
Time-saving
Exposure Quality
Dynamic Autofocus
Exposure Speed
Full Facility Integration
User-friendly
Automated Loading Module
Manufacturing Execution System (MES)
Backside Alignment
Exposure Wavelengths
Multipurpose Vacuum Chuck
Service Contracts
Customer applications







Why customers choose our systems
John McLean, Principle Process Development Engineer
Centre for Process Innovation (CPI)
Sedgefield, England
Technical Data
Writing performance | Write mode 2 | Write mode 3 |
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Minimum lines and spaces [µm] | 2 | 3 |
Minimum feature size [µm] | 1.5 | 3 |
CD uniformity [3σ, nm] | 200 | 300 |
Edge roughness [3σ, nm] | 80 | 100 |
2nd layer alignment [3σ, nm] | 500 | 700 |
Backside alignment [3σ, nm] | 1000 | 1000 |
Exposure time (80 mJ/cm² and 405 nm laser) for 100 x 100 mm² | 2.75 min (one exposure module installed) | 1.5 min (one exposure module installed) |
Exposure time (80 mJ/cm² and 405 nm laser) for 200 x 200 mm² | 9 min (one exposure module installed) 4.7 min (two exposure modules installed) | 4.6 min (one exposure module installed) 2.5 min (two exposure modules installed) |
Exposure time (80 mJ/cm² and 405 nm laser) for 300 x 300 mm² | 19.5 min (one exposure module installed) 10 min (two exposure modules installed) | 9.6 min (one exposure module installed) 5 min (two exposure modules installed) |
Maximum write speed (405 nm laser) [mm²/min] | 4615 (one exposure module installed) 9000 (two exposure modules installed) | 9375 (one exposure module installed) 18000 (two exposure modules installed) |
System features | |
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Light source | High-power diode laser with long life-time at 375 nm and/or 405 nm |
Maximum substrate size | 300 x 300 mm² |
Maximum exposure area | 300 x 300 mm² |
Substrate thickness | 0.1 - 10 mm |
Internal temperature stability | ± 0.1°C |
Real-time autofocus | Optical and pneumatic autofocus |
Autofocus dynamic range | Up to 150 µm |
Alignment | Advanced alignment; backside alignment optional |
Automation | Automatic wafer handling and pre-alignment |
System dimensions (excluding loader) | |
Height × width × depth | 1980 mm x 1200 mm x 2310 mm |
Weight | 2600 kg |
Installation requirements | |
Electrical | 400 VAC, 50/60 Hz, 16 A |
Compressed air | 7 - 10 bar |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.