MLA 150 Maskless Aligner

The Modern Standard in Lithography

  • Product Description

  • Are you slowed down by the high costs and long lead times of photomasks? Do you want to iterate designs instantly without the lengthy training required for traditional mask aligners?

    Discover the MLA 150 and the world of digital lithography.

    The modern, maskless aligner replaces legacy technology with a fast, flexible, and remarkably easy-to-use solution engineered for the highest degree of performance. By using a digital mirror device (DMD) as a dynamic mask, the MLA 150 overcomes the drawbacks of physical photomasks. Go from a digital design to a perfectly patterned substrate in minutes, empowering your users to accelerate research in fields like quantum devices, MEMS, micro-optics, and life sciences.

    Why the MLA 150 is the Ideal Choice for Your Lab

    The MLA 150 was designed from the ground up to solve the core challenges of academic and industrial R&D facilities. It directly addresses issues like long lead times for photomasks, high recurring costs, and the steep learning curve of traditional systems.

    Engineered for the Multi-User Facility

    Reduce your training overhead and maximize tool uptime. The MLA 150 is so intuitive that new users can be fully qualified to work independently in less than one hour. Its user-friendly software and streamlined workflow are perfectly suited for a shared lab environment, which is why the MLA 150 has become an essential tool in leading cleanrooms worldwide.

    Unmatched Flexibility for Advanced Research and More

    Your work isn’t standard — and your lithography tool shouldn’t be either. Whether you’re advancing cutting-edge research, accelerating innovation through rapid prototyping, or producing high-quality small series, the MLA 150 adapts to your needs, not the other way around.

    • Handle a Broad Range of Resists: Install one or two different laser wavelengths (375 nm and/or 405 nm) simultaneously to expose the entire range of broadband, g-, h-, and i-line photoresists without hardware changes.
    • Work with Challenging Substrates: Specialized vacuum chucks allow you to easily handle difficult samples, including small substrate pieces down to 3×3 mm², thin foils, and warped wafers.
    • Create 2.5D and High-Aspect-Ratio Structures: Use the integrated Grayscale Exposure Mode to fabricate complex 2.5D microstructures, or the High-Aspect-Ratio Mode to pattern thick resists with steep sidewalls, ideal for MEMS and microfluidics.
    • Interactive ‘Draw Mode’: Directly draw and expose patterns onto the live camera image of your sample—perfect for quick prototyping or precisely placing electrodes onto unique features like graphene flakes or nanowires.

    High Speed, High Precision, No Compromises

    User-friendly doesn’t mean lower performance. The MLA 150 delivers the speed and accuracy you need to push the boundaries of fabrication.

    • Sub-Micron Resolution: Achieve a minimum feature size down to 0.45 μm to create complex, high-resolution devices.
    • Outstanding Throughput: Expose a full 150 mm wafer in less than 16 minutes.
    • Advanced Automated Alignment: The system achieves 250 nm alignment accuracy and digitally compensates for offset, rotation, scaling, and shearing—adjustments impossible with physical masks.
    • Perfect Focus: A dynamic autofocus system ensures sharp, uniform features, effectively handling patterned, warped, or delicate substrates.
    • Ultimate Stability: An integrated environmental chamber with temperature-controlled laminar airflow (±0.1°C) minimizes thermal expansion effects, ensuring stable and repeatable results.

    Drastically Reduce Your Operating Costs

    Eliminate the largest and most persistent expense in lithography: the photomask. With the MLA 150, there are no mask procurement costs and no associated multi-week lead times. You also eliminate cleaning and storage efforts and remove the risk of costly breakage. Combined with a laser lifetime of 10-20 years and easy maintenance, the MLA 150 offers an exceptionally low total cost of ownership.

    Key Applications

    From fundamental physics to applied biosciences, the MLA 150 is the trusted tool for:

    • Nanofabrication: Quantum devices, 2D materials, semiconductor nanowires
    • MEMS & MOEMS: Sensors, actuators, micro-optical elements, microfluidics
    • Materials Science: Patterning of novel materials
    • Life Sciences: Lab-on-a-chip devices, biosensors

    Join Hundreds of Leading Institutions

    See why top universities and research centers worldwide have chosen the MLA 150 to replace their mask aligners. Contact us to discover how to empower your users and modernize your lab.

    In 2025, we were celebrating 10 years of the MLA 150. Learn more about its history and the people behind it on our special anniversary page.

    Are you slowed down by the high costs and long lead times of photomasks? Do you want to iterate designs instantly without the lengthy training required for traditional mask aligners?

    Discover the MLA 150 and the world of digital lithography.

    The modern, maskless aligner replaces legacy technology with a fast, flexible, and remarkably easy-to-use solution engineered for the highest degree of performance. By using a digital mirror device (DMD) as a dynamic mask, the MLA 150 overcomes the drawbacks of physical photomasks. Go from a digital design to a perfectly patterned substrate in minutes, empowering your users to accelerate research in fields like quantum devices, MEMS, micro-optics, and life sciences.

    Why the MLA 150 is the Ideal Choice for Your Lab

    The MLA 150 was designed from the ground up to solve the core challenges of academic and industrial R&D facilities. It directly addresses issues like long lead times for photomasks, high recurring costs, and the steep learning curve of traditional systems.

    Engineered for the Multi-User Facility

    Reduce your training overhead and maximize tool uptime. The MLA 150 is so intuitive that new users can be fully qualified to work independently in less than one hour. Its user-friendly software and streamlined workflow are perfectly suited for a shared lab environment, which is why the MLA 150 has become an essential tool in leading cleanrooms worldwide.

    Unmatched Flexibility for Advanced Research and More

    Your work isn’t standard — and your lithography tool shouldn’t be either. Whether you’re advancing cutting-edge research, accelerating innovation through rapid prototyping, or producing high-quality small series, the MLA 150 adapts to your needs, not the other way around.

    • Handle a Broad Range of Resists: Install one or two different laser wavelengths (375 nm and/or 405 nm) simultaneously to expose the entire range of broadband, g-, h-, and i-line photoresists without hardware changes.
    • Work with Challenging Substrates: Specialized vacuum chucks allow you to easily handle difficult samples, including small substrate pieces down to 3×3 mm², thin foils, and warped wafers.
    • Create 2.5D and High-Aspect-Ratio Structures: Use the integrated Grayscale Exposure Mode to fabricate complex 2.5D microstructures, or the High-Aspect-Ratio Mode to pattern thick resists with steep sidewalls, ideal for MEMS and microfluidics.
    • Interactive ‘Draw Mode’: Directly draw and expose patterns onto the live camera image of your sample—perfect for quick prototyping or precisely placing electrodes onto unique features like graphene flakes or nanowires.

    High Speed, High Precision, No Compromises

    User-friendly doesn’t mean lower performance. The MLA 150 delivers the speed and accuracy you need to push the boundaries of fabrication.

    • Sub-Micron Resolution: Achieve a minimum feature size down to 0.45 μm to create complex, high-resolution devices.
    • Outstanding Throughput: Expose a full 150 mm wafer in less than 16 minutes.
    • Advanced Automated Alignment: The system achieves 250 nm alignment accuracy and digitally compensates for offset, rotation, scaling, and shearing—adjustments impossible with physical masks.
    • Perfect Focus: A dynamic autofocus system ensures sharp, uniform features, effectively handling patterned, warped, or delicate substrates.
    • Ultimate Stability: An integrated environmental chamber with temperature-controlled laminar airflow (±0.1°C) minimizes thermal expansion effects, ensuring stable and repeatable results.

    Drastically Reduce Your Operating Costs

    Eliminate the largest and most persistent expense in lithography: the photomask. With the MLA 150, there are no mask procurement costs and no associated multi-week lead times. You also eliminate cleaning and storage efforts and remove the risk of costly breakage. Combined with a laser lifetime of 10-20 years and easy maintenance, the MLA 150 offers an exceptionally low total cost of ownership.

    Key Applications

    From fundamental physics to applied biosciences, the MLA 150 is the trusted tool for:

    • Nanofabrication: Quantum devices, 2D materials, semiconductor nanowires
    • MEMS & MOEMS: Sensors, actuators, micro-optical elements, microfluidics
    • Materials Science: Patterning of novel materials
    • Life Sciences: Lab-on-a-chip devices, biosensors

    Join Hundreds of Leading Institutions

    See why top universities and research centers worldwide have chosen the MLA 150 to replace their mask aligners. Contact us to discover how to empower your users and modernize your lab.

    In 2025, we were celebrating 10 years of the MLA 150. Learn more about its history and the people behind it on our special anniversary page.

    > 250 installed systems

  • Product Highlights

  • Perfect for Multi-User Facilities

    Less than 1h training to fully qualify as a user

    Fast and Accurate Alignment

    250 nm front alignment, backside alignment, alignment error compensation

    Flexible

    Two lasers can be installed simultaneously on the same system to expose the whole range of photoresist
    Different exposure modes available for fast or high-quality structuring
    Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates

    Low Operation Costs and Easy Maintenance

    10-20 years of laser lifetime

    Direct-Write Lithography

    No mask-related costs, effort, or security risks

    Grayscale Mode

    For simple 2.5D structures

    Exposure Quality

    Edge roughness 60 nm; CD uniformity 100 nm; autofocus compensation for warped/corrugated substrates

    Minimum Feature Size

    Two different write modes available with a minimum feature size down to 0.45 μm

    User-Friendly

    Specifically designed software and workflow make the tool operation fast and easy

    Exposure Speed

    150 mm wafer in <16 min with 405 nm laser
  • Available Modules

  • Exposure Wavelength

    Diode laser sources at 375 nm and/or 405 nm can be mounted together and used interchangeably to expose different photoresists

    Exchangeable Chucks

    Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates
    Customized vacuum chuck layout upon request

    Draw Mode

    Import and overlay of BMP files on top of the real-time microscope image – as in a virtual mask aligner; simple lines and shapes can be drawn into the real-time camera image for immediate exposure

    Autofocus

    Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

    Variable Substrate Sizes

    From 3 mm to 9″

    Advanced Field Alignment

    Automatic field-by-field alignment on individual dies on the wafer for superior alignment accuracy

    Optional Automatic Loading System

    Can handle masks up to 7″ and wafers up to 8″. A second cassette station, and a prealigner and wafer scanner are available as options.

Are you slowed down by the high costs and long lead times of photomasks? Do you want to iterate designs instantly without the lengthy training required for traditional mask aligners?

Discover the MLA 150 and the world of digital lithography.

The modern, maskless aligner replaces legacy technology with a fast, flexible, and remarkably easy-to-use solution engineered for the highest degree of performance. By using a digital mirror device (DMD) as a dynamic mask, the MLA 150 overcomes the drawbacks of physical photomasks. Go from a digital design to a perfectly patterned substrate in minutes, empowering your users to accelerate research in fields like quantum devices, MEMS, micro-optics, and life sciences.

Why the MLA 150 is the Ideal Choice for Your Lab

The MLA 150 was designed from the ground up to solve the core challenges of academic and industrial R&D facilities. It directly addresses issues like long lead times for photomasks, high recurring costs, and the steep learning curve of traditional systems.

Engineered for the Multi-User Facility

Reduce your training overhead and maximize tool uptime. The MLA 150 is so intuitive that new users can be fully qualified to work independently in less than one hour. Its user-friendly software and streamlined workflow are perfectly suited for a shared lab environment, which is why the MLA 150 has become an essential tool in leading cleanrooms worldwide.

Unmatched Flexibility for Advanced Research and More

Your work isn’t standard — and your lithography tool shouldn’t be either. Whether you’re advancing cutting-edge research, accelerating innovation through rapid prototyping, or producing high-quality small series, the MLA 150 adapts to your needs, not the other way around.

  • Handle a Broad Range of Resists: Install one or two different laser wavelengths (375 nm and/or 405 nm) simultaneously to expose the entire range of broadband, g-, h-, and i-line photoresists without hardware changes.
  • Work with Challenging Substrates: Specialized vacuum chucks allow you to easily handle difficult samples, including small substrate pieces down to 3×3 mm², thin foils, and warped wafers.
  • Create 2.5D and High-Aspect-Ratio Structures: Use the integrated Grayscale Exposure Mode to fabricate complex 2.5D microstructures, or the High-Aspect-Ratio Mode to pattern thick resists with steep sidewalls, ideal for MEMS and microfluidics.
  • Interactive ‘Draw Mode’: Directly draw and expose patterns onto the live camera image of your sample—perfect for quick prototyping or precisely placing electrodes onto unique features like graphene flakes or nanowires.

High Speed, High Precision, No Compromises

User-friendly doesn’t mean lower performance. The MLA 150 delivers the speed and accuracy you need to push the boundaries of fabrication.

  • Sub-Micron Resolution: Achieve a minimum feature size down to 0.45 μm to create complex, high-resolution devices.
  • Outstanding Throughput: Expose a full 150 mm wafer in less than 16 minutes.
  • Advanced Automated Alignment: The system achieves 250 nm alignment accuracy and digitally compensates for offset, rotation, scaling, and shearing—adjustments impossible with physical masks.
  • Perfect Focus: A dynamic autofocus system ensures sharp, uniform features, effectively handling patterned, warped, or delicate substrates.
  • Ultimate Stability: An integrated environmental chamber with temperature-controlled laminar airflow (±0.1°C) minimizes thermal expansion effects, ensuring stable and repeatable results.

Drastically Reduce Your Operating Costs

Eliminate the largest and most persistent expense in lithography: the photomask. With the MLA 150, there are no mask procurement costs and no associated multi-week lead times. You also eliminate cleaning and storage efforts and remove the risk of costly breakage. Combined with a laser lifetime of 10-20 years and easy maintenance, the MLA 150 offers an exceptionally low total cost of ownership.

Key Applications

From fundamental physics to applied biosciences, the MLA 150 is the trusted tool for:

  • Nanofabrication: Quantum devices, 2D materials, semiconductor nanowires
  • MEMS & MOEMS: Sensors, actuators, micro-optical elements, microfluidics
  • Materials Science: Patterning of novel materials
  • Life Sciences: Lab-on-a-chip devices, biosensors

Join Hundreds of Leading Institutions

See why top universities and research centers worldwide have chosen the MLA 150 to replace their mask aligners. Contact us to discover how to empower your users and modernize your lab.

In 2025, we were celebrating 10 years of the MLA 150. Learn more about its history and the people behind it on our special anniversary page.

Are you slowed down by the high costs and long lead times of photomasks? Do you want to iterate designs instantly without the lengthy training required for traditional mask aligners?

Discover the MLA 150 and the world of digital lithography.

The modern, maskless aligner replaces legacy technology with a fast, flexible, and remarkably easy-to-use solution engineered for the highest degree of performance. By using a digital mirror device (DMD) as a dynamic mask, the MLA 150 overcomes the drawbacks of physical photomasks. Go from a digital design to a perfectly patterned substrate in minutes, empowering your users to accelerate research in fields like quantum devices, MEMS, micro-optics, and life sciences.

Why the MLA 150 is the Ideal Choice for Your Lab

The MLA 150 was designed from the ground up to solve the core challenges of academic and industrial R&D facilities. It directly addresses issues like long lead times for photomasks, high recurring costs, and the steep learning curve of traditional systems.

Engineered for the Multi-User Facility

Reduce your training overhead and maximize tool uptime. The MLA 150 is so intuitive that new users can be fully qualified to work independently in less than one hour. Its user-friendly software and streamlined workflow are perfectly suited for a shared lab environment, which is why the MLA 150 has become an essential tool in leading cleanrooms worldwide.

Unmatched Flexibility for Advanced Research and More

Your work isn’t standard — and your lithography tool shouldn’t be either. Whether you’re advancing cutting-edge research, accelerating innovation through rapid prototyping, or producing high-quality small series, the MLA 150 adapts to your needs, not the other way around.

  • Handle a Broad Range of Resists: Install one or two different laser wavelengths (375 nm and/or 405 nm) simultaneously to expose the entire range of broadband, g-, h-, and i-line photoresists without hardware changes.
  • Work with Challenging Substrates: Specialized vacuum chucks allow you to easily handle difficult samples, including small substrate pieces down to 3×3 mm², thin foils, and warped wafers.
  • Create 2.5D and High-Aspect-Ratio Structures: Use the integrated Grayscale Exposure Mode to fabricate complex 2.5D microstructures, or the High-Aspect-Ratio Mode to pattern thick resists with steep sidewalls, ideal for MEMS and microfluidics.
  • Interactive ‘Draw Mode’: Directly draw and expose patterns onto the live camera image of your sample—perfect for quick prototyping or precisely placing electrodes onto unique features like graphene flakes or nanowires.

High Speed, High Precision, No Compromises

User-friendly doesn’t mean lower performance. The MLA 150 delivers the speed and accuracy you need to push the boundaries of fabrication.

  • Sub-Micron Resolution: Achieve a minimum feature size down to 0.45 μm to create complex, high-resolution devices.
  • Outstanding Throughput: Expose a full 150 mm wafer in less than 16 minutes.
  • Advanced Automated Alignment: The system achieves 250 nm alignment accuracy and digitally compensates for offset, rotation, scaling, and shearing—adjustments impossible with physical masks.
  • Perfect Focus: A dynamic autofocus system ensures sharp, uniform features, effectively handling patterned, warped, or delicate substrates.
  • Ultimate Stability: An integrated environmental chamber with temperature-controlled laminar airflow (±0.1°C) minimizes thermal expansion effects, ensuring stable and repeatable results.

Drastically Reduce Your Operating Costs

Eliminate the largest and most persistent expense in lithography: the photomask. With the MLA 150, there are no mask procurement costs and no associated multi-week lead times. You also eliminate cleaning and storage efforts and remove the risk of costly breakage. Combined with a laser lifetime of 10-20 years and easy maintenance, the MLA 150 offers an exceptionally low total cost of ownership.

Key Applications

From fundamental physics to applied biosciences, the MLA 150 is the trusted tool for:

  • Nanofabrication: Quantum devices, 2D materials, semiconductor nanowires
  • MEMS & MOEMS: Sensors, actuators, micro-optical elements, microfluidics
  • Materials Science: Patterning of novel materials
  • Life Sciences: Lab-on-a-chip devices, biosensors

Join Hundreds of Leading Institutions

See why top universities and research centers worldwide have chosen the MLA 150 to replace their mask aligners. Contact us to discover how to empower your users and modernize your lab.

In 2025, we were celebrating 10 years of the MLA 150. Learn more about its history and the people behind it on our special anniversary page.

> 250 installed systems

Perfect for Multi-User Facilities

Less than 1h training to fully qualify as a user

Fast and Accurate Alignment

250 nm front alignment, backside alignment, alignment error compensation

Flexible

Two lasers can be installed simultaneously on the same system to expose the whole range of photoresist
Different exposure modes available for fast or high-quality structuring
Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates

Low Operation Costs and Easy Maintenance

10-20 years of laser lifetime

Direct-Write Lithography

No mask-related costs, effort, or security risks

Grayscale Mode

For simple 2.5D structures

Exposure Quality

Edge roughness 60 nm; CD uniformity 100 nm; autofocus compensation for warped/corrugated substrates

Minimum Feature Size

Two different write modes available with a minimum feature size down to 0.45 μm

User-Friendly

Specifically designed software and workflow make the tool operation fast and easy

Exposure Speed

150 mm wafer in <16 min with 405 nm laser

Exposure Wavelength

Diode laser sources at 375 nm and/or 405 nm can be mounted together and used interchangeably to expose different photoresists

Exchangeable Chucks

Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates
Customized vacuum chuck layout upon request

Draw Mode

Import and overlay of BMP files on top of the real-time microscope image – as in a virtual mask aligner; simple lines and shapes can be drawn into the real-time camera image for immediate exposure

Autofocus

Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

Variable Substrate Sizes

From 3 mm to 9″

Advanced Field Alignment

Automatic field-by-field alignment on individual dies on the wafer for superior alignment accuracy

Optional Automatic Loading System

Can handle masks up to 7″ and wafers up to 8″. A second cassette station, and a prealigner and wafer scanner are available as options.

Customer applications

Why customers choose our systems

"The MLA 150 is a very good compromise between flexibility, throughput, and performance. In our multiuser facilities, it is highly appreciated for fast prototyping on substrates of various dimensions and shapes. Because the acquisition of the MLA 150 has been a game changer in our lithography department we decided to get a second one."

Dr. Philippe Flückiger, Director of Operations
Ecole Polytechnique Fédérale de Lausanne (EPFL) Center of MicroNanoTechnology (CMi)
Lausanne, Switzerland

"At DTU Nanolab, part of the technical university of Denmark, we now have multiple maskless aligners from Heidelberg instruments. These tools fit our research-based operation perfectly, while also providing versatile tools for many of our industrial customers. One specific observation we made since we got our maskless aligners was a significant drop in the number of new masks ordered for our mask aligners, which dropped from about 1 mask per day to about 1 mask per month. Overall, we are very happy with our maskless aligners, both from the personnel side and the user side."

Jens H. Hemmigsen, Process Specialist
DTU Nanolab (Technical University of Denmark)
Lyngby, Denmark

"The MLA 150 direct laser writer, with its ease-of-use and versatility, is the ideal photolithography equipment. Since photomasks are no longer required to expose the wafer, the MLA 150 has helped to dramatically reduce the time & costs associated to the development and research on prototypes that require frequent changes in the layout."

Dr. Julien Dorsaz, Senior Photolithography Engineer
EPFL (CMi)
Lausanne, Switzerland

"The speed, ease of use, and accuracy of the MLA 150 led us to choose it over a mask aligner.
It is one of our key tools for photolithography work at MCN. Users employ it for direct writing on various sample types (silicon, glass, quartz, diamond, lithium niobate, etc.) and sizes (ranging from 3 mm × 3 mm up to 7 in × 7 in mask plates), as well as for photomask fabrication.
Exposing a full 6-in wafer with 2 µm-diameter circles and 2 µm spacings would not have been possible without it."

Dr. Yang Choon Lim, Senior Process Engineering Team Lead
Melbourne Centre for Nanofabrication (MCN)
Melbourne, Australia

"We work largely in a pilot-line and development environment and find that the flexibility of the MLA 150 is extremely useful for testing new design concepts. This is particularly true for the numerous research users we support in the cleanroom. We also find that the MLA 150 provides great value for our wafer scale-up work, where we can test different device designs on smaller tiles before committing to large wafer mask–based processes.
The MLA 150 is one of the most consistently utilized pieces of equipment in our cleanroom. Users find its ability to jump straight from concept to design to sample exposure extremely appealing."

Dr. Tom Peach, Senior Process Engineer
Institute for Compound Semiconductors, Cardiff University
Cardiff, UK

Technical Data

Write Mode I *Write Mode II *
Writing performance
Minimum feature size [μm]0.6 (0.45 optional)1
Minimum Lines and Spaces [μm]0.8 (0.45 optional)1.2
Global 2nd layer alignment [nm]500500
Local 2nd layer alignment [nm] 250250
Backside alignment [nm]10001000
Max. write speed 405 nm laser [mm²/min] 4001400
Max. write speed 375 nm laser [mm²/min] 400600
System features
Light sourceDiode lasers: 8 W at 405 nm, 2.8 W at 375 nm, or both
Substrate sizesVariable: 3 x 3 mm² to 9″ x 9″ | Customizable on request
Substrate thickness0 - 12 mm
Maximum exposure area150 x 150 mm² | Optional: 200 x 200 mm²
Temperature controlled flow boxTemperature stability ± 0.1 °C
Real-time autofocusAir-gauge or optical
Autofocus compensation range180 μm
Grayscale128 gray levels
Software featuresExposure wizard, resist database, automatic labeling and serialization, Draw Mode for CADless exposures, substrate tracking / history
System dimensions (lithography unit)
Height × width × depth1950 mm × 1300 mm × 1300 mm
Weight1100 kg
Installation requirements
Electrical230 VAC ± 5%, 50/60 Hz, 16 A
Compressed air6 - 10 bar
Economical considerations
Saves on the cost of photomasks
Low running costs for maintenance, energy consumption, spare parts
Solid state laser light sources with lifetime of several years
* Only one write mode can be installed on the system

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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Advancing neural interfaces: a framework for the fabrication and characterization of freestanding micro-nanodevicesJanuary 12, 2026Microsystems & Nanoengineering (nature)

A comprehensive framework for fabricating, harvesting, and characterizing freestanding micro-nanodevices, enabling minimally invasive, wireless neural interfaces with subcellular resolution and scalable neuromodulation potential.

A Mechanophenotyping Chip for High-Throughput Detection of Metastatic Bacteria-Infected Circulating Tumor CellsJanuary 8, 2026nature communications

LesM microfluidic chip captures and mechanophenotypes circulating tumor cells, distinguishing bacteria-infected breast cancer cells via deformation, linking microbial cargo and biomechanics to metastatic risk and antibiotic response.

Bubble detachment from patterned solid surfaces: Roles of wettability contrast and domain geometryDecember 15, 2025ScienceDirect

Patterned wettability contrasts control bubble detachment, revealing contact-line pinning, geometry-dependent volumes, and deviations from classical models, offering insights to improve hydrogen electrolysis and mineral flotation efficiency.

Stretchable Porous Membranes for Barrier Tissue Models with Real-Time Measurement and Biomimetic Cyclic StrainNovember 13, 2025MDPI

Gold microelectrodes patterned on porous, stretchable PDMS membranes enable impedance sensing under cyclic strain, advancing barrier tissue models and applications in wearables, robotics, and devices.

A nonsurgical brain implant enabled through a cell–electronics hybrid for focal neuromodulationNovember 5, 2025nature biotechnology

Circulatronics uses immune cell–electronics hybrids for nonsurgical brain neuromodulation, enabling intravenous delivery, autonomous targeting of inflammation, wireless photovoltaic stimulation, and neural control without invasive surgery.

Texture-engineered fabrication of ultraflat, 6-inch single-crystal Cu(111) wafersOctober 29, 2025Science Advances

Scalable fabrication of twin-boundary-free Cu(111) wafers enables ultraflat 6-inch substrates for high-quality wafer-scale graphene with excellent uniformity, low resistance, and high carrier mobility performance metrics.

Batch fabrication of ultra-sharp atomic force microscope probes with stair-shaped handles for high-precision imagingOctober 21, 2025Microsystems & Nanoengineering (nature)

Scalable batch-fabricated silicon AFM probes integrate ultra-sharp high-aspect-ratio tips and stair-shaped handles, enabling 5 nm resolution, unobstructed laser detection, compatibility, and durable high-fidelity nanoscale imaging.

Single-Step 3D Patterning of Negative Resists via Maskless AlignerOctober 2, 2025Heidelberg Instruments

Demonstrates single-step 3D patterning of negative resists using maskless aligner, enabling complex microstructures for biomedical, MEMS, and microfluidic applications.

A Decade of Discovery: Heidelberg Instruments’ MLA 150 Maskless Aligner Turns 10September 18, 2025Heidelberg Instruments

Heidelberg Instruments proudly celebrates the 10th anniversary of the MLA 150 Maskless Aligner—a breakthrough that has redefined high-resolution lithography in cleanrooms around the world.

µCodes: A Universal Grid Platform for Microscale Mapping, Microscopy Navigation, and Multimodal ImagingAugust 21, 2025Small

µCodes is a microgrid system enabling precise sample tracking and image alignment across diverse optical and electron microscopy modalities.

Microscopic geared metamachinesAugust 20, 2025nature communications

Optically driven metasurfaces power on-chip micromachines, enabling lithographically fabricated gear trains and micromechanisms down to tens of micrometers with sub-micrometer precision and scalable integration capabilities.

Low-loss superconducting resonators fabricated from tantalum films grown at room temperatureAugust 16, 2025nature communications

Room-temperature growth of α-tantalum on silicon using niobium seed layers yields superconducting resonators with state-of-the-art quality factors, enabling low-thermal-budget integration for qubit circuits applications.

Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry processJuly 11, 2025Microsystems & Nanoengineering (nature)

CMOS-compatible SOI foundry integration enables scalable silicon NEM switches with low-voltage operation, volatile and nonvolatile modes, paving high-density logic and memory for extreme environments.

Picoeukaryote-based biohybrid microrobots for active delivery in the kidneyJuly 11, 2025Science Advances

Picoeukaryote-based biohybrid microrobots enable active drug delivery in confined environments, demonstrating strong motility, kidney penetration, long-term retention, biosafety, and immune evasion in vivo.

Engineering flexible superblack materialsMay 19, 2025nature communications

A scalable silicon-mold and polymer-casting platform produces flexible, durable superblack materials with 0.15% reflectance, angle-insensitive Lambertian behavior, and customizable surfaces for advanced optical applications.

Tunable chiral magneto-transport through band structure engineering in magnetic topological insulators Mn(Bi1−xSbx)2Te4May 16, 2025Science Advances

Sb alloying in Mn(Bi,Sb)2Te4 tunes Berry curvature, spin chirality, and harmonic Hall responses, inducing topological transitions and reversible anomalous Hall effects for chiral spin-orbitronic devices.

Strategies to Extend Resolution Limits for Direct Write LithographyApril 23, 2025SPIE. Digital Library

This presentation introduces methods for optimizing various direct-writing lithography systems from Heidelberg Instruments to push the resolution limit for smaller structures in collaboration with IMS Chips Germany.

Wire suspended on a v-groove cavity to measure gas physical propertiesMay 31, 2024Heidelberg Instruments, University of Twente

Thermal flow sensors measure fluid flow by detecting heat dissipation from a heated wire. A novel silicon-based design compensates for fluctuations ensuring accuracy.

Hollow silicon-based microneedle array for dermal interstitial fluid extraction fabricated by only dry etching on wafer scaleMay 31, 2024EPFL, Heidelberg Instruments, Xsensio

Silicon-based microneedles enable interstitial fluid biomarker extraction. Proposed dry etching technique achieves mass production compatibility, enhancing biomedical applications for minimally invasive diagnostics and monitoring.

Biosynthesis enhancement of tropodithietic acid (TDA) antibacterial compound through biofilm formation by marine bacteria Phaeobacter inhibens on micro-structured polymer surfacesFebruary 1, 2024Heidelberg Instruments, Technical University of Denmark (DTU)

Microfluidic channels cultivate Phaeobacter inhibens biofilms on diverse polymer surfaces, offering biocontrol potential in aquaculture by mitigating antibiotic risks. Creating diverse surfaces to promote biosynthesis.

Small Projectiles Featuring Triple-Layer Metal Cladding with Potential Applications in the field of Cell TransfectionSeptember 27, 2023Heidelberg Instruments, IDUN DTU

Micro-projectiles were created through maskless UV lithography, O2 plasma treatment, silicon etching, and metal cladding. These conical micro-projectiles have applications in magnetically guided cell transfection.

Spin-acoustic control of silicon vacancies in 4H silicon carbideSeptember 17, 2023nature electronics

Spin-acoustic control demonstrated on a 4H silicon carbide-based bulk acoustic resonator allows frequency-tunable probing of resonances, aiding in dynamic strain distribution analysis for microelectromechanical systems.

Aperture-Controlled Fabrication of All-Dielectric Structural Color PixelsJune 29, 2023ACS Applied Materials & Interfaces

CMOS-compatible aperture-controlled deposition enabled microscopic all-dielectric structural color pixels, producing vibrant wafer-scale images through interference effects without costly electron-beam lithography.

Self-aligned single-electrode actuation of tangential and wineglass modes using PMN-PTMay 17, 2023Microsystems & Nanoengineering (nature)

PMN–PT thin film disks, with single-electrode actuation, showcase self-aligned tangential and wineglass modes for high-frequency bulk acoustic wave (BAW) MEMS gyroscopes.

MEMS micro-coils for magnetic neurostimulationMay 1, 2023Biosensors and Bioelectronics (ScienceDirect)

Innovative MEMS micro-coil probe fabrication overcame brain stimulation challenges, validated in vivo. International collaboration advances micro-magnetic stimulation for applications like artificial vision and hearing.

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