Stepper-Level Performance with Unmatched Flexibility for R&D, Prototyping, and Microfabrication
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Product Description
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Break free from the constraints, costs, and delays of photomasks. The VPG 300 DI is a high-performance direct write lithography system designed to accelerate your innovation cycle from weeks to hours. By combining the precision of a traditional i-line stepper with the powerful advantages of a maskless workflow, the VPG 300 DI empowers researchers and engineers to pattern high-resolution microstructures directly onto wafers up to 300 mm with unparalleled speed and flexibility.
The Power of a Stepper, The Freedom of Direct Write
The VPG 300 DI closes the gap between R&D and production. It provides the sub-micron resolution and tight overlay accuracy you expect from a mask-based stepper, while eliminating the significant expenses and lead times associated with mask procurement. This makes it the ideal solution for rapid prototyping, process development, and applications requiring frequent design iterations.
From CAD to Exposure in Minutes, Not Weeks
Instantly transfer your design to the substrate and iterate at the speed of thought. The VPG 300 DI’s advanced optical engine allows you to test new designs daily, not monthly, dramatically accelerating your development timeline.
- High-Speed Exposure: A custom spatial light modulator (SLM) and optimized data path enable you to write a 100×100 mm2 area in just 9 minutes.
- Stitching-Free Large Areas: Create large-area devices or dies of virtually unlimited size without the stitching errors inherent to steppers.
- Instant Design Changes: Modify your CAD file and begin exposing immediately. No need to order, wait for, inspect, and store a new mask.
Achieve Exceptional Feature Fidelity
Your research demands precision. Built upon our field-proven VPG+ platform with a high-stability Zerodur® stage, the VPG 300 DI delivers outstanding quality for your most demanding microstructures.
- High Resolution: Reliably produce critical structures smaller than 500 nm.
- Superior Edge Quality: Achieve an edge roughness of less than 40 nm (3σ).
- Excellent CD Uniformity: Maintain tight process control with a CD uniformity of less than 50 nm (3σ).
Intelligent Tools for Complex Device Fabrication
From multi-layer MEMS to advanced packaging, the VPG 300 DI is equipped with sophisticated systems to ensure perfect alignment and focus across the entire substrate.
- Automated Multi-Layer Alignment: Achieve topside alignment accuracy down to 100 nm. The system also supports automated VIS and IR backside alignment for buried structures.
- Dynamic Autofocus: A choice of optical or pneumatic autofocus systems dynamically compensates for wafer warpage or topography variations > 160 µm, ensuring sharp focus everywhere.
- Integrated Metrology: Perform on-the-fly measurements of position, CD, and edge roughness directly within the tool, providing immediate process feedback.
- Environmental Stability: An integrated flowbox and ambient condition sensors with software compensation ensure stable and repeatable writing results day after day.
Ready to Eliminate the Mask Bottleneck?
Discover how the VPG 300 DI can revolutionize your fabrication workflow. Contact our specialists to discuss your research and learn how direct writing can accelerate your success.
Break free from the constraints, costs, and delays of photomasks. The VPG 300 DI is a high-performance direct write lithography system designed to accelerate your innovation cycle from weeks to hours. By combining the precision of a traditional i-line stepper with the powerful advantages of a maskless workflow, the VPG 300 DI empowers researchers and engineers to pattern high-resolution microstructures directly onto wafers up to 300 mm with unparalleled speed and flexibility.
The Power of a Stepper, The Freedom of Direct Write
The VPG 300 DI closes the gap between R&D and production. It provides the sub-micron resolution and tight overlay accuracy you expect from a mask-based stepper, while eliminating the significant expenses and lead times associated with mask procurement. This makes it the ideal solution for rapid prototyping, process development, and applications requiring frequent design iterations.
From CAD to Exposure in Minutes, Not Weeks
Instantly transfer your design to the substrate and iterate at the speed of thought. The VPG 300 DI’s advanced optical engine allows you to test new designs daily, not monthly, dramatically accelerating your development timeline.
- High-Speed Exposure: A custom spatial light modulator (SLM) and optimized data path enable you to write a 100×100 mm2 area in just 9 minutes.
- Stitching-Free Large Areas: Create large-area devices or dies of virtually unlimited size without the stitching errors inherent to steppers.
- Instant Design Changes: Modify your CAD file and begin exposing immediately. No need to order, wait for, inspect, and store a new mask.
Achieve Exceptional Feature Fidelity
Your research demands precision. Built upon our field-proven VPG+ platform with a high-stability Zerodur® stage, the VPG 300 DI delivers outstanding quality for your most demanding microstructures.
- High Resolution: Reliably produce critical structures smaller than 500 nm.
- Superior Edge Quality: Achieve an edge roughness of less than 40 nm (3σ).
- Excellent CD Uniformity: Maintain tight process control with a CD uniformity of less than 50 nm (3σ).
Intelligent Tools for Complex Device Fabrication
From multi-layer MEMS to advanced packaging, the VPG 300 DI is equipped with sophisticated systems to ensure perfect alignment and focus across the entire substrate.
- Automated Multi-Layer Alignment: Achieve topside alignment accuracy down to 100 nm. The system also supports automated VIS and IR backside alignment for buried structures.
- Dynamic Autofocus: A choice of optical or pneumatic autofocus systems dynamically compensates for wafer warpage or topography variations > 160 µm, ensuring sharp focus everywhere.
- Integrated Metrology: Perform on-the-fly measurements of position, CD, and edge roughness directly within the tool, providing immediate process feedback.
- Environmental Stability: An integrated flowbox and ambient condition sensors with software compensation ensure stable and repeatable writing results day after day.
Ready to Eliminate the Mask Bottleneck?
Discover how the VPG 300 DI can revolutionize your fabrication workflow. Contact our specialists to discuss your research and learn how direct writing can accelerate your success.
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Product Highlights
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Exposure Speed
Custom made high-speed spatial light modulator; optimized optical engine performance and data path. Can write a 100 x 100 mm2 area in 9 minutesExposure Quality
Edge roughness < 40 nm, CD uniformity < 50 nm, resolution < 500 nmAlignment Accuracy
2nd layer alignment (topside) down to 100 nm, backside VIS / IR ±1 µmAutomated Alignment
Automated global and local alignment with distortion corrections; VIS backside alignment; IR alignment for buried structuresAutofocus
Optical or pneumatic autofocus with dynamic compensation > 160 µmIncluded metrology functions
Position, CD and edge roughnessWriting Stability
Integrated ambient metrology, flowbox, and software corrections to compensate environmental changes -
Available Modules
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Automatic handling options
Open frame handling with SEMI standard carriers and prealigning available for 100 to 200 mm or 200 / 300 mm standard wafers (others on request)Two write modes to choose from
High NA for highest resolution or lower NA optimized for throughput or DOF critical applicationsAlignment options
VIS and IR backside alignmentService Contracts
Worldwide service level agreements for faster on-site support and access to spare parts
Break free from the constraints, costs, and delays of photomasks. The VPG 300 DI is a high-performance direct write lithography system designed to accelerate your innovation cycle from weeks to hours. By combining the precision of a traditional i-line stepper with the powerful advantages of a maskless workflow, the VPG 300 DI empowers researchers and engineers to pattern high-resolution microstructures directly onto wafers up to 300 mm with unparalleled speed and flexibility.
The Power of a Stepper, The Freedom of Direct Write
The VPG 300 DI closes the gap between R&D and production. It provides the sub-micron resolution and tight overlay accuracy you expect from a mask-based stepper, while eliminating the significant expenses and lead times associated with mask procurement. This makes it the ideal solution for rapid prototyping, process development, and applications requiring frequent design iterations.
From CAD to Exposure in Minutes, Not Weeks
Instantly transfer your design to the substrate and iterate at the speed of thought. The VPG 300 DI’s advanced optical engine allows you to test new designs daily, not monthly, dramatically accelerating your development timeline.
- High-Speed Exposure: A custom spatial light modulator (SLM) and optimized data path enable you to write a 100×100 mm2 area in just 9 minutes.
- Stitching-Free Large Areas: Create large-area devices or dies of virtually unlimited size without the stitching errors inherent to steppers.
- Instant Design Changes: Modify your CAD file and begin exposing immediately. No need to order, wait for, inspect, and store a new mask.
Achieve Exceptional Feature Fidelity
Your research demands precision. Built upon our field-proven VPG+ platform with a high-stability Zerodur® stage, the VPG 300 DI delivers outstanding quality for your most demanding microstructures.
- High Resolution: Reliably produce critical structures smaller than 500 nm.
- Superior Edge Quality: Achieve an edge roughness of less than 40 nm (3σ).
- Excellent CD Uniformity: Maintain tight process control with a CD uniformity of less than 50 nm (3σ).
Intelligent Tools for Complex Device Fabrication
From multi-layer MEMS to advanced packaging, the VPG 300 DI is equipped with sophisticated systems to ensure perfect alignment and focus across the entire substrate.
- Automated Multi-Layer Alignment: Achieve topside alignment accuracy down to 100 nm. The system also supports automated VIS and IR backside alignment for buried structures.
- Dynamic Autofocus: A choice of optical or pneumatic autofocus systems dynamically compensates for wafer warpage or topography variations > 160 µm, ensuring sharp focus everywhere.
- Integrated Metrology: Perform on-the-fly measurements of position, CD, and edge roughness directly within the tool, providing immediate process feedback.
- Environmental Stability: An integrated flowbox and ambient condition sensors with software compensation ensure stable and repeatable writing results day after day.
Ready to Eliminate the Mask Bottleneck?
Discover how the VPG 300 DI can revolutionize your fabrication workflow. Contact our specialists to discuss your research and learn how direct writing can accelerate your success.
Break free from the constraints, costs, and delays of photomasks. The VPG 300 DI is a high-performance direct write lithography system designed to accelerate your innovation cycle from weeks to hours. By combining the precision of a traditional i-line stepper with the powerful advantages of a maskless workflow, the VPG 300 DI empowers researchers and engineers to pattern high-resolution microstructures directly onto wafers up to 300 mm with unparalleled speed and flexibility.
The Power of a Stepper, The Freedom of Direct Write
The VPG 300 DI closes the gap between R&D and production. It provides the sub-micron resolution and tight overlay accuracy you expect from a mask-based stepper, while eliminating the significant expenses and lead times associated with mask procurement. This makes it the ideal solution for rapid prototyping, process development, and applications requiring frequent design iterations.
From CAD to Exposure in Minutes, Not Weeks
Instantly transfer your design to the substrate and iterate at the speed of thought. The VPG 300 DI’s advanced optical engine allows you to test new designs daily, not monthly, dramatically accelerating your development timeline.
- High-Speed Exposure: A custom spatial light modulator (SLM) and optimized data path enable you to write a 100×100 mm2 area in just 9 minutes.
- Stitching-Free Large Areas: Create large-area devices or dies of virtually unlimited size without the stitching errors inherent to steppers.
- Instant Design Changes: Modify your CAD file and begin exposing immediately. No need to order, wait for, inspect, and store a new mask.
Achieve Exceptional Feature Fidelity
Your research demands precision. Built upon our field-proven VPG+ platform with a high-stability Zerodur® stage, the VPG 300 DI delivers outstanding quality for your most demanding microstructures.
- High Resolution: Reliably produce critical structures smaller than 500 nm.
- Superior Edge Quality: Achieve an edge roughness of less than 40 nm (3σ).
- Excellent CD Uniformity: Maintain tight process control with a CD uniformity of less than 50 nm (3σ).
Intelligent Tools for Complex Device Fabrication
From multi-layer MEMS to advanced packaging, the VPG 300 DI is equipped with sophisticated systems to ensure perfect alignment and focus across the entire substrate.
- Automated Multi-Layer Alignment: Achieve topside alignment accuracy down to 100 nm. The system also supports automated VIS and IR backside alignment for buried structures.
- Dynamic Autofocus: A choice of optical or pneumatic autofocus systems dynamically compensates for wafer warpage or topography variations > 160 µm, ensuring sharp focus everywhere.
- Integrated Metrology: Perform on-the-fly measurements of position, CD, and edge roughness directly within the tool, providing immediate process feedback.
- Environmental Stability: An integrated flowbox and ambient condition sensors with software compensation ensure stable and repeatable writing results day after day.
Ready to Eliminate the Mask Bottleneck?
Discover how the VPG 300 DI can revolutionize your fabrication workflow. Contact our specialists to discuss your research and learn how direct writing can accelerate your success.
Exposure Speed
Exposure Quality
Alignment Accuracy
Automated Alignment
Autofocus
Included metrology functions
Writing Stability
Automatic handling options
Two write modes to choose from
Alignment options
Service Contracts
Customer applications
Why customers choose our systems
"The VPG allows us to realize copper lines and chip-to-chip interconnects with a size down to 1 µm, which is three times smaller in feature size than when using the conventional mask aligner process."
Markus Wöhrmann
Group leader Lithography and Thin Film Polymers for Wafer Level Packaging
Fraunhofer Institute for Microintegration and Reliability
Berlin, Germany
"At TNO @ Holst Centre, the Heidelberg Instruments VPG is instrumental in our Research and Development effort by providing the ability to cycle quickly through design iterations and developing and optimizing manufacturing process flows of these designs."
Auke Jisk Kronemeijer, Research Manager Thin Film Electronics
TNO @ Holst Centre
Eindhoven, Netherlands
Technical Data
| Write mode | I | II |
|---|---|---|
| Writing performance | ||
| Minimum feature size [µm] | 0.5 | 0.8 |
| Minimum lines and spaces [µm] | 0.8 | 1.2 |
| Address Grid [nm] | 4 | 8 |
| Edge roughness [3σ, nm] | 30 | 40 |
| CD uniformity [3σ, nm] | 50 | 60 |
| 2nd layer alignment (global) [nm] | 100 | 130 |
| Write speed [mm2/min] | 340* | 1020* |
| *Fast mode: 680 and 2056 mm2/min with similar performance, but without specification | ||
| Exposure time for 100 x 100 mm2 area [min] | 39 | 17 |
| System features | ||
|---|---|---|
| Light source | High-power DPSS laser with 355 nm | |
| Maximum substrate size and write area | 300 x 300 mm2 | |
| Substrate thickness | 0 to 12 mm (other thicknesses on request) | |
| Maximum exposure area | 300 x 300 mm2 | |
| Autofocus | Realtime autofocus system (optical and pneumatic) | |
| Autofocus compensation range | > 160 µm | |
| Flowbox | (Closed-loop) temperature controlled environmental chamber | |
| Alignment and metrology | Camera system and software package for metrology and alignment | |
| Other features and options | Full automatic handling and prealigning of 100, 150, 200, and 300 mm wafers. Optical edge detection, topside alignment and optional IR and backside alignment. Zerodur® stage and high-resolution differential interferometer | |
| System dimensions | ||
| System / Electronic rack | ||
| Width [mm] | 2605 / 800 | |
| Depth [mm] | 1652 / 650 | |
| Height [mm] | 2102 / 1800 | |
| Weight [kg] | 3550 / 180 | |
| Installation requirements | ||
| Electrical | 400 VAC ± 5 %, 50/60 Hz, 16 A, 3 phases | |
| Compressed air | 6 - 10 bar |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.
